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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com omnipolar detection hall ic (dual outputs for both s and n pole polarity detection) BU52077GWZ general description the BU52077GWZ is omnipolar hall ic incorporating a polarity determination circuit that enables separate operation (output) of both the south and north poles. the polarity judgment is based on the output processing configuration. th is hall ic product can be in tablets, smart phones, and other applications in order to detect open and close of the cover. and th is hall ic product can be in di gital video cameras and other applications involving display panels in or der to detect the front/back location or determine the rotational direction of the panel. features ? omnipolar detection (polarity detection for both s and n poles with separate, dual outputs) ? micro power operation (small current using intermittent operation method) ? ultra-compact csp4 package (ucsp35l1) ? polarity judgment and separate output on both poles (out1=s-pole output; out2=n-pole output) ? high esd resistance 8kv(hbm) applications ? tablets, smart phones, notebook computers, digital video cameras, digital still cameras, etc. key specifications ? vdd voltage range: 1.65v to 3.6v ? operate point: 15.0mt(typ) ? hysteresis: 0.9mt(typ) ? period: 50ms(typ) ? supply current (avg): 5.0a (typ) ? ou tput type: cmos ? operating temperature range: -40c to +85c package w(typ) x d(typ) x h(max) ucsp35l1 0.80mm x 0.80mm x 0.40mm typical application circuit , block diagram , pin configurations and pin descriptions pin no. pin name function a1 gnd ground a2 out2 output (react to the north pole) b1 vdd power supply b2 out1 output (react to the south pole) the cmos output terminals enable direct connection to the pc, with no external pull -up resistor required. adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. gnd sample & hold out1 out2 gnd latch latch hall element b2 0.1f vdd a1 a2 b1 vdd dynamic offset cancellation timing logic (bottom view) (top view) a1 b2 b1 a2 a2 b2 b1 a1 datashee t downloaded from: http:///
2/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ contents general description .................................................................................................................................................... 1 features ....................................................................................................................................................................... 1 applications ................................................................................................................................................................ 1 key specifications ...................................................................................................................................................... 1 package w(typ) x d(typ) x h(max) ........................................................................................................................ 1 typical application circuit, block diagram, pin configurations and pin descriptions ...................................... 1 absolute maximum ratings (ta = 25c) ................................................................................................................... 3 recommended operating conditions (ta= -40c to +85c) ................................................................................... 3 magnetic, electrical characteristics (unless otherwise specified v dd =1.80v ta=25c) ...................................... 3 measurement circuit .................................................................................................................................................. 4 typical performance curves ..................................................................................................................................... 5 figure 6. operate point, release point vs ambient temperature ...................................................................... 5 figure 7. operate point, release point vs supply voltage ................................................................................. 5 figure 8. period vs ambient temperature ............................................................................................................ 5 figure 9. period vs supply voltage ....................................................................................................................... 5 figure 10. supply current vs ambient temperature ........................................................................................... 6 figure 11. supply current vs supply voltage ....................................................................................................... 6 description of operations .......................................................................................................................................... 7 intermittent operation at power on ....................................................................................................................... 10 magnet selection ...................................................................................................................................................... 10 slide-by position sensing ........................................................................................................................................ 11 position of the hall element (reference) ............................................................................................................... 11 footprint dimensions (optimize footprint dimensions to the board design and soldering condition) .......... 11 i/o equivalence circuit ............................................................................................................................................. 11 operational notes ..................................................................................................................................................... 12 ordering information ................................................................................................................................................ 14 marking diagrams ..................................................................................................................................................... 14 physical dimension, tape and reel information ................................................................................................... 15 revision history ....................................................................................................................................................... 16 downloaded from: http:///
3/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ absolute maximum ratings (ta = 25c) parameter symbol rating unit power supply voltage v dd -0.1 to +4.5 (note 1) v output current i out 0.5 ma power dissipation pd 0.10 (note 2) w operating temperature range t opr -40 to +85 c storage temperature range t stg -40 to +125 c ( no te 1) not to exceed pd (not e 2) mounted on 24mm x 20mm x 1.6mm glass epoxy board. reduce 1. 00mw per 1 c above 25 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= - 40 c to +85 c ) parameter symbol min typ max unit power supply voltage v dd 1.65 1.80 3.60 v magnetic, electrical characteristics (unless otherwise specified v dd =1.80v ta=25c) parameter symbol min typ max unit conditions operate point b ops - 15.0 19.0 mt output : out1 (react to the south pole) b opn -19.0 -15.0 - output : out2 (react to the north pole) release point b rps 10.1 14.1 - mt output : out1 (react to the south pole) b rpn - -14.1 -10.1 output : out2 (react to the north pole) hysteresis b hyss - 0.9 - mt b hysn - 0.9 - period t p - 50 100 ms output high voltage v oh v dd -0.2 - - v b rpn 4/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ measurement circuit vdd v oh 100f vdd gnd o ut 1 /out2 v i out figure 3. v oh measurement circuit v ol vdd 100f vdd gnd out1 /out2 i out v figure 4. v ol measurement circuit b op /b rp vdd 100f vdd gnd out1 /out2 v bop and brp are measured by applying an external magnetic field figure 1 . b op ,b rp measurement circuit figure 2. t p measurement circuit the period is monitored by an oscilloscope t p 2 00 ? vdd vdd gnd out1 /out2 oscilloscope i dd vdd 2200 f vdd gnd out1 /out2 a figure 5. i dd measurement circuit downloaded from: http:///
5/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ typical performance curves figure 6. operate point, release point vs ambient temperature figure 7. operate point, release point vs supply voltage figure 8. period vs ambient temperature figure 9. period vs supply voltage -20.0 -10.0 0.0 10.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [c] operate point, release point [mt] -20.0 -10.0 0.0 10.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage v operate point, release point [mt] 0 10 20 30 40 50 60 70 80 90 100 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] period [ms] 0 10 20 30 40 50 60 70 80 90 100 -60 -40 -20 0 20 40 60 80 100 ambient temperature [c] period [ms] v dd =1.8v ta=25c v dd =1.8v bop s brp s brp n bop n bop s brp s brp n bop n ta=25c downloaded from: http:///
6/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ typical performance curves - continued figure 10. supply current vs ambient temperature figure 11. supply current vs supply voltage 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -60 -40 -20 0 20 40 60 80 100 ambient temperature [c] supply current [a] 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 supply voltage [v] supply current [a] v dd =1.8v ta=25c downloaded from: http:///
7/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ description of operations micropower operation (small current consumption using intermittent se nsing) (offset cancellation) the dual output omnipolar detection hall ic uses intermittent sensing save energy. at startup the hall elements, amplifier, comparator, and other detection circuit s power on and magnetic detection begins. during standby, the detection circuits power off, thereby reducing current consumption. the detection results are held while sta ndby is active, and then output. reference period: 50ms (max100ms) reference startup time: 48 s i dd standby time startup time period 50ms t figure 12 the hall elements form an equivalent wheatstone (resistor) bridge circuit. offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress . a dynamic offset cancellation circuit is employed to canc el this offset voltage. when the hall elements are connected as shown in figur e 13 and a magnetic field is applied perpendicular to the hall elements, a voltage is generated at the mid-point terminal of the bridge. this is known as hall voltage. dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 angle from its original path, and thereby cancels the hall voltage. the magnetic signal (only) is maintained in the sampl e/hold circuit during the offset cancellation process and then released. gnd v dd i b hall voltage figure 13 downloaded from: http:///
8/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ (magnetic field detection mechanism) the hall ic cannot detect magnetic fields that run horizontal to t he package top layer. be certain to configure the hall ic so that the magnetic field is p erpendicular to the top layer. the out1 pin detects and outputs for the s-pole only. si nce the out1 pin output is unipolar, the output does not respond to the n-pole. b l ow brp s bop s 0 high n-pole magnetic flux density [mt] flux high high out1[v] n n s s s n s-pole out1 figure 15. s-pole detection flux figure 14 s s n s n s n flux direction flux directi on downloaded from: http:///
9/ 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ the out2 pin detects and outputs for the n-pole only. si nce the out2 pin output is unipolar, the output does not resp ond to the s-pole. the dual output omnipolar detection hall ic detects magnetic fields running perpendicular to the t op surface of the package. there is an inverse relationship between magne tic flux density and the distance separating the magnet and the hall ic: when distance increases magnetic density falls. when it drops below the operate point (bop), output goes high. when the magnet gets closer to the ic and magnetic dens ity rises to the operate point, the output switches low. in l ow output mode, the distance from the magnet to the ic increas es again until the magnetic density falls to a point just below bop, and output returns high. the point where magnetic flux density restores a high output is known as the release point, brp. this detection and adjustment mechanism is designed to pre vent noise, oscillation, and other erratic system operation. flux b bop n brp n 0 high n-pole magnetic flux density [mt] figure 16. n-pole detection flux high high l ow out2[v] n n s s s n s-pole out2 downloaded from: http:///
10 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ intermittent operation at power on the dual output omnipolar detection hall ic adopts an interm ittent operation method in detecting the magnetic field du ring startup, as shown in figure 17. the ic outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. the time fro m power on until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period of 10 0ms. to accommodate the system design, the hall ic output r ead should be programmed within 100ms of power on, but after the time allowed for the period, ambient temperature, and supply voltage. magnet selection of the two representative varieties of permanent magnet, neodym ium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturiz ation, thus, neodymium is best suited for small equipme nt applications. figure 18 shows the relation between the si ze (volume) of a neodymium magnet and magnetic flux den sity. the graph plots the correlation between the distance (l) fro m three versions of a 4mm x 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density . figure 19 shows hall ic detection distance C a good guide for determining the proper size and detection distance o f the magnet. based on the BU52077GWZ operating point max o f 19.0mt, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 4.4mm, 5.5mm, and 6.1mm, respectively. to increase the magnets detection distance, either increases the magnets thickness or sectional area. x=y=4mm t=1mm,2mm,3mm fig.2 bu52011hfv ? x t y flux density measuring point l: variable ? t figure 19. magnet dimensions and flux density measuring point ma gnet size magnet power on vdd startup time standby time standby time startup time (intermittent action) indefinite interval out (no magnetic field present) indefinite interval out (magnetic field present) low high supply current figure 17 magnet material: neomax-44h (material) maker: neomax co.,ltd. 0 5 10 15 20 25 0 2 4 6 8 10 12 14 16 18 20 distance between magnet and hall ic [mm] magnetic flux density [mt] figure 18. magnetic flux density vs distance between magnet and hall ic t=1mm t=3mm t=2mm 4.4mm 5.5mm 6.1mm downloaded from: http:///
11 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ slide-by position sensing figure 20 depicts the slide-by configuration employed for positio n sensing. note that when the gap (d) between the magnet and the hall ic is narrowed, the reverse magnetic field ge nerated by the magnet can cause the ic to malfunction. as se en in figure 21 , the magnetic field runs in opposite directions at point a and point b. since the dual output omnipolar detection hall ic can detect the s-pole at point a and the n-pole at poin t b, the sensor can switch the output on as the magnet slides by in the process of position detection. figure 22 plots magnetic flux density during the magnet slide-by. although a reverse magnetic field was generated in the process, the magnetic flux density decreases compared with the center of the magnet. this demonstrates that slightly widening the gap (d) between the magnet and hall ic reduces the reverse magnetic field and prevents malfunctions. position of the hall element (reference) footprint dimensions (optimize footprint dimensions to the board design and solderin g condition) i/o equivalence circuit symbol reference value e 0.40 b3 0.20 sd 0.20 se 0.20 -10.0 -5.0 0.0 5.0 10.0 0 2 4 6 8 10 horizontal distance from the magnet [mm] magnetic flux density [mt] the hall ics output pins are configured for cmos (inverter) output removing the need for external resistance and allo w direct connection to the host. removing the need for external resistors allows for reduction of the current that would otherwise flow to the external resistor during magnetic field detection thereby supporting an overall lower current (micropower) operation. gnd vdd out1, out2 figure 23 l figure 20 d magnet hall ic slide reverse figure 22. magnetic flux density vs horizontal distance from the magnet figure 21 b s a n flux flux (unit : mm) 0.40 0.40 0.25 ucsp35l1 e se sd e b3 ucsp35l1 (unit mm) downloaded from: http:///
12 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the i c can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
13 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitabl y formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutu al interference among circuits, operational faults, or physi cal damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoid ed. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even i f the power supply voltage is applied, make sure that th e input pins have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. disturbance light in a device where a portion of silicon is exposed to lig ht such as in a wl -csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to co me up with countermeasures that will prevent the chip from being exposed to light. downloaded from: http:///
14 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ ordering information b u 5 2 0 7 7 g w z - e 2 part number package gwz:ucsp35l1 packaging and forming specification e2: embossed tape and reel marking diagrams ucsp35l1 (top view) part number marking lot number 1pin mark g 7 downloaded from: http:///
15 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ physical dimension, tape and reel information package name ucsp35l1(BU52077GWZ) < tape and reel information > tape embossed carrier tape quantity 3000 pcs direction of feed e2 the direction is the pin 1 of product is at the upper lef t when you hold reel on the left hand and you pull out the tape on the right hand unit [mm] downloaded from: http:///
16 / 16 tsz02201-0m2m0f414010-1-2 ? 2014 rohm co., ltd. all rights reserved. 11.aug.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU52077GWZ revision history date revision changes 11 .aug.2014 001 new release downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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